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      主講: Bruce C. Kim  教授

      時間:2019年6月21日 9:00

      地點:信息樓C308

      主辦:信息與通信工程學院


      專家簡介:Bruce C. Kim教授現供職于紐約城市大學,從事本科生和研究生教學工作,為國際微電子與封裝協會(IMAPS)會員、IEEE CPMT 學會組委會成員,曾于1997年獲得美國國家科學基金會獎。Bruce C. Kim教授在MEMS器件、納米技術、納米傳感器、微電子封裝、生物醫學器件、片上系統、射頻集成電路和混合集成電路等方面都有廣泛的研究,曾獲多家基金資助,發表二百余篇論文。Bruce C. Kim教授任IEEE Design and Test of Computers、IEEE Transactions on Advanced Components、Journal of Testing Technology、IMAPS Journal of Microelectroincs期刊責任編輯。


      報告主要內容:

      Internet-of-Things are becoming part of our everyday lives in consumer electronics as well as medical and avionics. IoT devices make up an information infrastructure; however, this infrastructure could be in danger due to cyber hardware uncertainties related to encryption, verification, Trojan hardware, and remote hacking. These uncertainties can lead to an unsafe regulatory environment, an unstable economy, increased cyber-security threats, and other major issues. Therefore, we need to protect the hardware from the circuit design phase to the manufacturing. However, the packaged IoT devices are difficult to protect against future Trojan virus due to their global design and manufacturing phases. Every IoT device has integrated Wi-Fi circuits. An integral RF component can also be realized using TSVs, thus reducing the footprint of the inductor on the die and making the inductance density per unit area much higher than that of the conventional 2D on-chip spiral inductors.

      This seminar describes the design of through-silicon via (TSV)-based inductors for secure tunable Internet-of-Things (IoT). For a cybersecurity infrastructure, we designed 3D inductors with security hardware using physically unclonable function (PUF) circuit. The secure 3D inductor could be tuned to desirable frequency by using MEMS switches. Different fabrication techniques of 3D TSV inductors are provided to maintain high Q and inductance in high frequency.

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